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Additional objectives of the Chips Joint Undertaking ◄

1. In addition to the objectives set out in Articles 4 and 5, the Chips Joint Undertaking ◄ shall have the following general objectives:

(a) reinforce the Union’s strategic autonomy in electronic components and systems to support future needs of vertical industries and the economy at large. The overall target is to contribute towards doubling the value of the design and production of electronic components and systems in Europe by 2030, in line with the weight of the Union in products and services;

(b) establish Union scientific excellence and innovation leadership in emerging components and systems technologies, including in activities related to lower TRLs; and promote the active involvement of SMEs, which, for all research and innovation activities, including those related to the Chips for Europe Initiative established by Regulation (EU) 2023/1781, shall represent at least one third of the total number of participants in indirect actions and at least 20 % of public funding should go to them;

(c) ensure that components and systems technologies address Europe’s societal and environmental challenges. The target is to align with the Union policy on energy efficiency and contribute towards the reduction of energy consumption by 32,5 % in 2030;

(d) achieve large-scale technological capacity building and support related research and innovation activities throughout the Union’s semiconductor value chain to enable development and deployment of cutting-edge semiconductor technologies, next-generation semiconductor technologies and cutting-edge quantum technologies and the innovation of established technologies that will reinforce advanced design, systems integration and chip production capabilities in the Union, thereby increasing the competitiveness of the Union; and contribute to the achievement of the green and digital transitions, in particular by reducing the climate impact of electronic systems, improving the sustainability of next-generation chips and strengthening the circular economy processes, contribute to quality jobs within the semiconductor ecosystem and address security-by-design principles, which provide protection against cybersecurity threats.

2. In addition to the objectives set out in paragraph 1, the Chips Joint Undertaking ◄ shall have the following specific objectives:

(a) support research and development for establishing design and production capabilities in Europe for strategic application areas;

(b) launch a balanced portfolio of large and small projects supporting the fast transfer of technologies from the research to the industrial environment;

(c) foster a dynamic Union-wide ecosystem based on digital value-chains with simplified access to newcomers;

(d) support research and development for enhancing component technologies that guarantee security, trust and energy-efficiency for critical infrastructures and sectors in Europe;

(e) foster mobilisation of national resources and ensure coordination of Union and national research and innovation programmes in the field of electronic components and systems;

(f) establish coherence between the Strategic Research and Innovation Agenda of the Chips Joint Undertaking ◄ and Union policies so that electronics components and systems technologies contribute efficiently;

(g) build up advanced design capacities for integrated semiconductor technologies;

(h) enhance existing and develop new advanced pilot lines across the Union to enable development and deployment of cutting-edge semiconductor technologies and next-generation semiconductor technologies;

(i) build advanced technology and engineering capacities for accelerating the innovative development of cutting-edge quantum chips and associated semiconductor technologies;

(j) establish a network of competence centres across the Union by enhancing existing or creating new facilities.